TECHBND
5289
0.290

TECHBND

5289
idss
TECHBOND GROUP BERHAD KLSE Summary
Main Market : Chemicals

0.290

0.000 (0.0%)
High 0.290
Low 0.290
Open 0.290
Volume 60,000
Volume (B/S) 147,000 / 35,000
Price Bid/Ask 0.290 / 0.295
   
52w 0.260 - 0.330
ROE 7.00
P/E 11.53
EPS 2.52
DPS 0.75
DY 2.59%
 
NTA 0.3600
P/B 0.81
RPS 16.90
PSR 1.72
Market Cap 220.0M
Shares (mil) 758.70
YoY
CAGR
3Y 1234% TTM 2014%
5Y 816% TTM 1064%
RSI(14) Neutral 55.4
Stochastic(14) Neutral 33.3
Stochastic RSI(14) Neutral 37.5
Average Volume (3M) 308,900
Relative Volume 0.6
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EPS DPS NTA Revenue P/L Quarter Q Date Financial Year Announced ROE QoQ% YoY% Report
30 Jun, 2026
0.7300 0.000 0.3600 32.8m 5.5m 4 2026-06-30 30 Jun, 2026 2026-08-20 2.0% 34.8% 83.6%
0.5400 0.000 0.3500 30.8m 4.1m 3 2026-03-31 30 Jun, 2026 2026-05-21 1.5% 12.2% 7.2%
0.6200 0.000 0.3400 31.8m 4.7m 2 2025-12-31 30 Jun, 2026 2026-02-11 1.8% 2.8% 26.6%
0.6300 0.750 0.3500 32.9m 4.8m 1 2025-09-30 30 Jun, 2026 2025-11-21 1.8% 59.6% 130.1%
30 Jun, 2025
0.4300 0.000 0.3700 34.1m 3.0m 4 2025-06-30 30 Jun, 2025 2025-08-21 1.2% 31.9% 38.9%
0.5900 0.000 0.3700 37.6m 4.4m 3 2025-03-31 30 Jun, 2025 2025-05-29 1.6% 30.6% 9.4%
0.9400 0.000 0.3500 38.4m 6.4m 2 2024-12-31 30 Jun, 2025 2025-02-20 2.7% 205.1% 46.3%
0.3300 1.000 0.3300 36.4m 2.1m 1 2024-09-30 30 Jun, 2025 2024-11-27 1.0% 57.6% 32.4%
30 Jun, 2024
0.9100 0.000 0.3600 38.5m 4.9m 4 2024-06-30 30 Jun, 2024 2024-08-22 2.5% 22% 6.5%
0.7600 0.500 0.3400 36.1m 4.0m 3 2024-03-31 30 Jun, 2024 2024-05-27 2.2% 7.2% 37.9%
0.8100 0.750 0.3300 40.2m 4.3m 2 2023-12-31 30 Jun, 2024 2024-02-22 2.5% 40.9% 358.4%
0.5800 0.000 0.3300 36.4m 3.1m 1 2023-09-30 30 Jun, 2024 2023-11-30 1.8% 41.3% 31.4%
30 Jun, 2023
0.9900 0.000 0.3200 34.1m 5.3m 4 2023-06-30 30 Jun, 2023 2023-08-23 3.1% 79.8% 18.5%
0.5600 0.000 0.3100 26.6m 2.9m 3 2023-03-31 30 Jun, 2023 2023-05-24 1.8% 273.9% 3.6%
-0.3200 0.500 0.3100 24.9m -1.7m 2 2022-12-31 30 Jun, 2023 2023-02-27 -1.0% 137.4% 165.1%
0.8500 0.000 0.3100 23.4m 4.5m 1 2022-09-30 30 Jun, 2023 2022-11-23 2.7% 1.4% 234.1%
30 Jun, 2022
0.8400 0.000 0.3000 24.4m 4.4m 4 2022-06-30 30 Jun, 2022 2022-08-24 2.8% 57.2% 68.9%
0.5400 0.000 0.2900 22.8m 2.8m 3 2022-03-31 30 Jun, 2022 2022-05-19 1.9% 9.2% 26.1%
0.4900 0.000 0.2900 22.6m 2.6m 2 2021-12-31 30 Jun, 2022 2022-02-23 1.7% 92% 1.4%
0.2500 0.000 0.2800 15.3m 1.3m 1 2021-09-30 30 Jun, 2022 2021-11-24 0.9% 48.7% 46.3%
30 Jun, 2021
0.5000 0.500 0.2900 22.5m 2.6m 4 2021-06-30 30 Jun, 2021 2021-08-26 1.7% 31.3% 6.3%
0.7300 0.000 0.2800 21.6m 3.8m 3 2021-03-31 30 Jun, 2021 2021-05-20 2.6% 49.9% 51.5%
1.1000 0.000 0.6100 23.7m 2.6m 2 2020-12-31 30 Jun, 2021 2021-02-25 1.8% 1.6% 15.5%
1.0900 1.000 0.6100 22.0m 2.5m 1 2020-09-30 30 Jun, 2021 2020-11-25 1.8% 1.5% 7.3%
30 Jun, 2020
1.0800 0.000 0.6000 14.0m 2.5m 4 2020-06-30 30 Jun, 2020 2020-08-27 1.8% 2% 18.2%
1.1000 0.000 0.5900 17.1m 2.5m 3 2020-03-31 30 Jun, 2020 2020-06-10 1.9% 16.4% 142.8%
1.3100 0.000 0.5700 20.8m 3.0m 2 2019-12-31 30 Jun, 2020 2020-02-27 2.3% 11.5% 5105.2%
1.1800 0.000 0.5600 19.4m 2.7m 1 2019-09-30 30 Jun, 2020 2019-11-28 2.1% 29.4% 30.3%
30 Jun, 2019
0.9100 0.000 0.5700 20.2m 2.1m 4 2019-06-30 30 Jun, 2019 2019-08-16 1.6% 101.4% 0%
0.4500 0.000 0.5600 17.1m 1.0m 3 2019-03-31 30 Jun, 2019 2019-05-15 0.8% 1691.4% 0%
0.0300 0.000 0.5500 20.9m 58.0k 2 2018-12-31 30 Jun, 2019 2019-02-21 0.1% 98.5% 0%
2.2900 0.000 0.5300 23.2m 3.9m 1 2018-09-30 30 Jun, 2019 2018-11-29 4.3% 0% 0%

Financial Year Revenue ('000) Net ('000) EPS DP% Net % Report
30 Jun, 2026 128,255 19,087 2.5200 29.76
30 Jun, 2025 146,516 15,874 2.2900 43.67 3.2% View
30 Jun, 2024 151,098 16,395 3.0600 40.85 48.9% View
30 Jun, 2023 108,947 11,008 2.0800 24.04 1.7% View
30 Jun, 2022 85,125 11,198 2.1200 - 2.7% View
30 Jun, 2021 89,839 11,511 3.4200 43.86 7.3% View
30 Jun, 2020 71,281 10,723 4.6700 - 51.6% View
30 Jun, 2019 81,379 7,073 3.6800 - View

Announced Financial Year Subject EX Date Payment Date Amount Indicator
30 Jun, 2026
21 Nov 2025 30 Jun 2026 First Interim Dividend 05 Dec 2025 24 Dec 2025 0.0075 Currency View
30 Jun, 2025
06 Nov 2024 30 Jun 2025 First Interim Dividend 20 Nov 2024 06 Dec 2024 0.0100 Currency View
30 Jun, 2024
27 May 2024 30 Jun 2024 First Interim Dividend 12 Jun 2024 03 Jul 2024 0.0050 Currency View
30 Jun, 2023
27 Oct 2023 30 Jun 2023 Final Dividend 30 Nov 2023 15 Dec 2023 0.0075 Currency View
30 Jun, 2022
28 Oct 2022 30 Jun 2022 Final Dividend 29 Dec 2022 17 Jan 2023 0.0050 Currency View
30 Jun, 2021
26 Aug 2021 30 Jun 2021 Second Interim Dividend 10 Sep 2021 30 Sep 2021 0.0050 Currency View
25 Nov 2020 30 Jun 2021 First Interim Dividend 21 Dec 2020 18 Jan 2021 0.0100 Currency View
30 Jun, 2020
03 Sep 2019 30 Jun 2020 Interim Dividend 20 Sep 2019 10 Oct 2019 0.0200 Currency View

Announced EX Date Subject Ratio Offer
12 Mar 2021 25 Mar 2021 Bonus Issue 5.0000 : 4.0000 View
06 Feb 2020 19 Feb 2020 Bonus Issue (warrant) 1.0000 : 2.0000 View

Name Price Change Volume Gearing Premium Premium % Maturity
No warrants found.

Announced Date Change Type Shares Name
03 Apr 2026 02 Apr 2026 Acquired 285,300 MADAM TAN SIEW GEAK
01 Apr 2026 30 Mar 2026 Acquired 331,200 SONICBOND SDN BHD
01 Apr 2026 30 Mar 2026 Acquired 331,200 MR LEE SENG THYE
30 Mar 2026 26 Mar 2026 Acquired 445,000 MR LEE SENG THYE
30 Mar 2026 26 Mar 2026 Acquired 445,000 SONICBOND SDN BHD
30 Mar 2026 26 Mar 2026 Acquired 262,800 MADAM TAN SIEW GEAK
27 Mar 2026 24 Mar 2026 Acquired 349,900 MR LEE YUEN SHIUAN
12 Mar 2026 09 Mar 2026 Acquired 60,000 MADAM TAN SIEW GEAK
12 Mar 2026 09 Mar 2026 Acquired 411,700 MR LEE SENG THYE
12 Mar 2026 10 Mar 2026 Acquired 299,000 MR LEE SENG THYE
12 Mar 2026 09 Mar 2026 Acquired 411,700 SONICBOND SDN BHD
12 Mar 2026 10 Mar 2026 Acquired 299,000 SONICBOND SDN BHD
09 Mar 2026 06 Mar 2026 Acquired 359,400 MADAM TAN SIEW GEAK
06 Mar 2026 04 Mar 2026 Acquired 519,000 MR LEE SENG THYE
06 Mar 2026 04 Mar 2026 Acquired 519,000 SONICBOND SDN BHD
03 Mar 2026 02 Mar 2026 Acquired 386,000 MADAM TAN SIEW GEAK
05 Dec 2025 03 Dec 2025 Acquired 500,000 SONICBOND SDN BHD
05 Dec 2025 04 Dec 2025 Acquired 290,500 MADAM TAN SIEW GEAK
05 Dec 2025 02 Dec 2025 Acquired 412,600 MR LEE SENG THYE
05 Dec 2025 03 Dec 2025 Acquired 500,000 MR LEE SENG THYE
05 Dec 2025 02 Dec 2025 Acquired 412,600 SONICBOND SDN BHD
16 Oct 2025 14 Oct 2025 Acquired 500,000 MR LEE SENG THYE
16 Oct 2025 14 Oct 2025 Acquired 500,000 SONICBOND SDN BHD
13 Oct 2025 09 Oct 2025 Acquired 300,000 SONICBOND SDN BHD
13 Oct 2025 09 Oct 2025 Acquired 300,000 MR LEE SENG THYE
10 Oct 2025 08 Oct 2025 Acquired 159,000 MR LEE SENG THYE
10 Oct 2025 08 Oct 2025 Acquired 159,000 SONICBOND SDN BHD
09 Oct 2025 07 Oct 2025 Acquired 77,300 MR LEE SENG THYE
09 Oct 2025 07 Oct 2025 Acquired 77,300 SONICBOND SDN BHD


Recent News
  • Techbond trades volume for margins
    MAIN Market-listed Techbond Group Bhd (KL:TECHBND) is trying to do more, with less. Over the past three years, the adhesive manufacturer has cut loose the low-margin, high-volume lines that once padded its top line. Instead, the group is now betting that its packaging and polymer business will ca...
    TheEdge
  • 投资平台|受战争冲击 郭鹤年加持 德宝投资潜能仍看好
     柔佛读者郭亚东问,作为工业胶粘剂和密封剂制造商,德宝集团(TECHBND,5289,主板工业产品服务组)的业务会受中东战争的影响吗?该公司的业务和投资前景如何?谢谢。————————————————答:德宝集团旗下的工业胶粘剂和密封剂制造,由于重要的原料受战争影响价格扬升,不过分析认为有关成本可控,并可转嫁客户,在计算地缘政治风险后,略下调财测,还是维持看好该公司的业务前景和投资潜能。兴业研究认为,由于美伊冲突,油价飙高,该公司的关键石化原料——醋酸乙烯单体(VAM)价格较冲突前水平上...
    Sinchew
  • Techbond growth intact amid costs
    PETALING JAYA: Techbond Group Bhd is expected to navigate near-term volatility from geopolitical tensions and higher input costs, with RHB Research maintaining a constructive outlook on the company's earnings trajectory and structural growth drivers.
    TheStar
  • 今日选股|成本压力可控 德宝下半年收入料回升
    券商 :兴业投行研究投资建议 :买进闭市价 :28.5仙 (截至4月17日)目标价 :37仙每股收益 :3仙 (2026财年估计)本益比 :10.26倍(2026财年估计)股息收益率:4.2% (2026财年估计)德宝集团(TECHBND,5289,主要板工业)虽然面临成本压力,但随着客户提前备货,并将上升的物流成本转嫁至终端市场,估计2026财年下半年收入将有所增长。醋酸乙烯单体(VAM)价格较冲突前水平上升5%至10%,由于此原料占该公司销售成本的80%至85%,因此将对赚幅...
    Chinapress
  • Rising raw material costs, margin pressure loom for Techbond, says RHB
    KUALA LUMPUR: Techbond Group Bhd expects the cost of vinyl acetate monomer to rise between five and 10 per cent compared to pre-conflict levels from oil price shocks.
    NST




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Lee Owen
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TECHBOND GROUP BERHAD (5289)
Current Price: RM 0.290
MBOW Public Analysis · v3.4
Analysis: 12 Aug 2026 23:59 MYT(收市后)
————————
MARKET STATE │ 结构状态
State: BASE
SP: 6 / 10
SPD: 7 / 10
周线已离开RM 0.260–0.275底部整理区,并进入周线云层下缘,但尚未取得云层上方的完整结构确认。
周线MACD在零轴下方转强,正柱持续扩张;OBV从低位回升,ADX则维持约21。本周K线尚未完成,因此只能判为BASE向上迁移。
一句总结:
周线BASE继续向上重建,日线突破获得量能参与,但RM 0.295–0.305及周线云层仍待正式突破。
————————
TIMEFRAME TRANSITION FLOW │ 周期迁移
30M: CLIMB ↑ — 价格突破RM 0.280–0.285并维持云上,MACD正动能扩张;但ADX仍低于20,OBV尚未同步创出明显新高。
4H: CLIMB ↑ — 价格位于云层及原整理平台上方,MACD继续扩张,OBV明显抬升;ADX约16,趋势强度确认仍滞后。
1D: CLIMB ↑ — 价格突破RM 0.280平台,MACD位于零轴上方扩张,ADX超过40,OBV同步创出图中高点。
1W: BASE ↑ — 周线高低点开始抬高,MACD与OBV同步修复,但价格只是进入下降云层下缘,本周尚未收盘。
1M: WEAK ↑ — 长期价格仍低于月线云层及主要价值区,MACD刚从深负值修复,ADX低于15,OBV维持低位横向。
Transition
1M ↑ | 1W ↑ | 1D ↑ | 4H ↑ | 30M ↑
五个周期方向一致向上,但月线与周线仍处于修复阶段,目前由日线及4H主导推进。
————————
MULTI-TIMEFRAME RESONANCE │ 多周期共振
月线长期下降结构尚未逆转,只能提供弱修复背景。
周线突破RM 0.275–0.280整理区,并开始测试下降云层,MACD与OBV支持BASE继续迁移。
日线、4H及30M同步云上推进,其中日线趋势强度和资金流确认最完整。
截图所列30个完整交易日平均成交量约1,645。12 Aug成交量4,253,约为该滚动均量2.59倍;10 Aug及06 Aug则分别约为1.76倍和2.41倍。
由于缺少12 Aug以前的完整30日独立基准,2.59倍只能作为滚动量能参考,不能当作正式事件日倍率。
同时,过去30日有多个交易日量能仅21–322,显示流动性分布不稳定,OBV也呈明显阶梯状。突破获得参与,但单日价格与指标容易受到少量成交影响。
共振结论:向上共振成立,但周线云层与流动性质量限制结构升级。
————————
STRUCTURE LEVELS │ 结构位
Resistance
R1: RM 0.295–0.305 — 当前卖盘、整数关口及周线云层直接压制区。
R2: RM 0.320–0.330 — 较高层周线供应区及52周高点附近。
Extended Resistance: 未启用。
Support
S1: RM 0.275–0.285 — 近期突破平台、日线与4H价值区。
S2: RM 0.260–0.270 — 07月低位结构与周线底部支撑区。
Failure Zone
FZ: RM 0.250–0.260
Formal Failure: Weekly Close < RM 0.250
Anchor: 周线重建底部、52周低位及VPVR下缘。
————————
PATH A │ 向上结构重建 50%
结构逻辑:
周线BASE向上迁移,日线至30M形成同向推进;12 Aug突破同时获得高于滚动均量的成交参与。
确认条件:
周线收盘高于RM 0.305,并在后续结构中守住RM 0.280–0.285;其后RM 0.320–0.330成为下一验证区。
————————
PATH B │ 云层附近换手 30%
结构逻辑:
价格正在进入周线云层与直接供应区,周线尚未完成,4H及30M趋势强度也未同步确认。
确认条件:
价格继续在RM 0.275–0.305之间整理,既未周线确认突破R1,也未收破S1。
————————
PATH C │ 突破失败回落 20%
结构逻辑:
长期月线仍属WEAK,当前突破建立在流动性不均的背景上;若量能快速消退,价格可能返回原整理区。
确认条件:
周线收盘低于RM 0.275,并伴随OBV回落或周线MACD改善停止,随后RM 0.260–0.270进入主要测试。
————————
FAILURE PATH │ 失败路径
Watch:
进入RM 0.250–0.260,但周线尚未收破RM 0.250。
Trigger:
Weekly Close < RM 0.250
Risk:
现有BASE结构及A/B/C路径分布失效,必须重新建立周线坐标并评估WEAK或DEAD。
Current:
未触发
————————
ACTIVE STRUCTURE │ 主动结构状态
Structure State:
BASE
Integrity:
受压
Failure Risk:
低
Transition:
进行中
向上迁移正在进行,但周线云层与不稳定流动性仍未允许结构升级为CLIMB。
————————
FINAL STRUCTURE STATE │ 最终结构状态
周线主状态为BASE,价格已经突破RM 0.275–0.280整理区,但尚未确认越过RM 0.295–0.305及周线下降云层。
RM 0.275–0.285是当前主要防守区,正式失效线为周线收盘低于RM 0.250。
日线至30M形成向上共振,12 Aug量能高于滚动均量,但本周收盘及持续流动性仍待确认。
当前结构属于:
Base Rebuilding with Weekly Cloud Breakout Pending │ 底部向上重建、周线云层突破待确认
————————
Disclaimer: This analysis is for educational and market-structure discussion only. It is not financial advice, not a buy or sell recommendation, and does not guarantee future price movement.
免责声明:本分析仅用于教育及市场结构讨论,不构成财务建议、买入或卖出建议,也不保证未来价格走势。
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Lee Owen
怎么说呢,这个很不错,,
1 Like · 1 week · translate
Vinson Lau
但他就是动都不动!! 等了很久下
Like · 1 week · translate
KYLE O
1 Like · Reply
Mr Robert kwok no support this ?
cheng
ready to move higher to reflect the profit growth?
Like · 2 weeks · translate
cheng
the higher usdmyr goes, the higher techbnd's revenue will be :)
Like · 1 week · translate